CY62157ELL-55BVXE
vs
IS61WV51216BLL-8TI
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
BGA
|
TSOP2
|
| Package Description |
6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48
|
PLASTIC, TSOP2-44
|
| Pin Count |
48
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
55 ns
|
8 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B48
|
R-PDSO-G44
|
| JESD-609 Code |
e1
|
e0
|
| Length |
8 mm
|
18.415 mm
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
44
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX16
|
512KX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSOP2
|
| Package Equivalence Code |
TSOP44,.46,32
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Standby Current-Max |
0.00003 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.035 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.75 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
6 mm
|
10.16 mm
|
| Base Number Matches |
3
|
1
|
| Samacsys Manufacturer |
|
Integrated Silicon Solution Inc.
|
|
|
|
Compare CY62157ELL-55BVXE with alternatives
Compare IS61WV51216BLL-8TI with alternatives