CY62167DV18LL-70BVI vs MB82D01161-85PBN feature comparison

CY62167DV18LL-70BVI Cypress Semiconductor

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MB82D01161-85PBN FUJITSU Limited

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP FUJITSU LTD
Part Package Code BGA BGA
Package Description 8 X 9.50 MM, 1 MM HEIGHT, BGA-48 TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 85 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Length 9.5 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -30 °C
Organization 1MX16 1MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Equivalence Code BGA48,6X8,30 BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Standby Current-Max 0.00001 A 0.0002 A
Standby Voltage-Min 1 V
Supply Current-Max 0.025 mA 0.025 mA
Supply Voltage-Max (Vsup) 1.95 V 2.7 V
Supply Voltage-Min (Vsup) 1.65 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 6 mm
Base Number Matches 2 2
Additional Feature ALSO OPERATES AT 2.7V TO 3.1V SUPPLY

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