CY7C1011G30-12ZSXE vs IS62US25616SL-70BI feature comparison

CY7C1011G30-12ZSXE Infineon Technologies AG

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IS62US25616SL-70BI Integrated Silicon Solution Inc

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG INTEGRATED SILICON SOLUTION INC
Reach Compliance Code compliant compliant
Factory Lead Time 2 Days
Samacsys Manufacturer Infineon
Access Time-Max 12 ns 70 ns
JESD-30 Code R-PDSO-G44 R-PBGA-B48
JESD-609 Code e4 e0
Length 18.415 mm
Memory Density 2097152 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.194 mm
Supply Voltage-Max (Vsup) 3.6 V 2.2 V
Supply Voltage-Min (Vsup) 2.2 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code BGA
Package Description MINI, BGA-48
Pin Count 48
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 2 V

Compare CY7C1011G30-12ZSXE with alternatives

Compare IS62US25616SL-70BI with alternatives