CY7C1041CV33-10ZCT
vs
71V416S10BEI8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSOP2
|
BGA
|
| Package Description |
TSOP2,
|
9 X 9 MM, BGA-48
|
| Pin Count |
44
|
48
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
10 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
S-PBGA-B48
|
| JESD-609 Code |
|
e0
|
| Length |
|
9 mm
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
16
|
| Moisture Sensitivity Level |
|
4
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
48
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
256KX16
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Equivalence Code |
|
BGA48,6X8,30
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Current-Max |
|
0.02 A
|
| Standby Voltage-Min |
|
3 V
|
| Supply Current-Max |
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.75 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
9 mm
|
|
|
|
Compare CY7C1041CV33-10ZCT with alternatives
Compare 71V416S10BEI8 with alternatives