CY7C1041CV33-10ZCT
vs
71V416VS10BEG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
TSOP2
|
BGA
|
Package Description |
TSOP2,
|
9 X 9 MM, ROHS COMPLIANT, BGA-48
|
Pin Count |
44
|
48
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Base Number Matches |
1
|
5
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Access Time-Max |
|
10 ns
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
S-PBGA-B48
|
JESD-609 Code |
|
e1
|
Length |
|
9 mm
|
Memory Density |
|
4194304 bit
|
Memory IC Type |
|
STANDARD SRAM
|
Memory Width |
|
16
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Terminals |
|
48
|
Number of Words |
|
262144 words
|
Number of Words Code |
|
256000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
256KX16
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TFBGA
|
Package Equivalence Code |
|
BGA48,6X8,30
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.2 mm
|
Standby Current-Max |
|
0.02 A
|
Standby Voltage-Min |
|
3 V
|
Supply Current-Max |
|
0.2 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.75 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
9 mm
|
|
|
|
Compare CY7C1041CV33-10ZCT with alternatives
Compare 71V416VS10BEG with alternatives