CY7C1051DV33-10ZSXI vs K6F8016V3M-RB55 feature comparison

CY7C1051DV33-10ZSXI Cypress Semiconductor

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K6F8016V3M-RB55 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description LEAD FREE, TSOP2-44 TSOP2-R,
Pin Count 44 44
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3
Length 18.415 mm 18.41 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2-R
Package Equivalence Code TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.194 mm 1.2 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10.16 mm 10.16 mm
Base Number Matches 2 1

Compare CY7C1051DV33-10ZSXI with alternatives

Compare K6F8016V3M-RB55 with alternatives