CY7C1061G30-10ZSXI
vs
CY7C1061AV33-10ZC
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
Length
22.415 mm
22.415 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
54
54
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
235
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.2 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
PURE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
2
2
Pbfree Code
No
Part Package Code
TSOP2
Package Description
TSOP2-54
Pin Count
54
JESD-609 Code
e0
Qualification Status
COMMERCIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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