CY7C1062G30-10BGXI vs CY7C1062G30-10BGXI feature comparison

CY7C1062G30-10BGXI Cypress Semiconductor

Buy Now Datasheet

CY7C1062G30-10BGXI Infineon Technologies AG

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INFINEON TECHNOLOGIES AG
Package Description 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e1
Length 22 mm 22 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 32 32
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 2
Factory Lead Time 2 Days
Samacsys Manufacturer Infineon
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare CY7C1062G30-10BGXI with alternatives

Compare CY7C1062G30-10BGXI with alternatives