CY7C1062G30-10BGXI vs CY7C1062AV33-10BGI feature comparison

CY7C1062G30-10BGXIT Infineon Technologies AG

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CY7C1062AV33-10BGI Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG CYPRESS SEMICONDUCTOR CORP
Package Description BGA-119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Reach Compliance Code compliant unknown
Factory Lead Time 10 Weeks
Samacsys Manufacturer Infineon
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e0
Length 22 mm 22 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 32 32
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Qualification Status Not Qualified
Standby Current-Max 0.05 A
Standby Voltage-Min 3 V
Supply Current-Max 0.275 mA

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