CY7C1303AV25-133BZC vs AS7C33128NTD36A-200BC feature comparison

CY7C1303AV25-133BZC Cypress Semiconductor

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AS7C33128NTD36A-200BC Alliance Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ALLIANCE SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description LBGA, BGA165,11X15,40 LQFP,
Pin Count 165 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 18874368 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.45 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.65 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm
Base Number Matches 1 1

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Compare AS7C33128NTD36A-200BC with alternatives