CY7C1306AV25-167BZC vs 71V3576YS150BGGI feature comparison

CY7C1306AV25-167BZC Cypress Semiconductor

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71V3576YS150BGGI Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA,
Pin Count 165 119
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.5 ns 3.8 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e0 e1
Length 15 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type QDR SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 2.36 mm
Standby Current-Max 0.47 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.75 mA
Supply Voltage-Max (Vsup) 2.6 V 3.465 V
Supply Voltage-Min (Vsup) 2.4 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 2

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