CY7C1307BV25-100BZC vs CY7C1345B-50AC feature comparison

CY7C1307BV25-100BZC Cypress Semiconductor

Buy Now Datasheet

CY7C1345B-50AC Cypress Semiconductor

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 LQFP,
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 11 ns
Additional Feature PIPELINED ARCHITECTURE SELF-TIMED WRITE
Clock Frequency-Max (fCLK) 100 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e0 e0
Length 15 mm 20 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type QDR SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Standby Voltage-Min 2.4 V
Supply Voltage-Max (Vsup) 2.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.4 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 13 mm 14 mm
Base Number Matches 1 1

Compare CY7C1307BV25-100BZC with alternatives

Compare CY7C1345B-50AC with alternatives