CY7C1318CV18-200BZXC vs UPD44164182AF5-E40-EQ2-A feature comparison

CY7C1318CV18-200BZXC Rochester Electronics LLC

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UPD44164182AF5-E40-EQ2-A NEC Electronics Group

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NEC ELECTRONICS CORP
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 LBGA,
Pin Count 165 165
Reach Compliance Code unknown compliant
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 18
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.4 mm 1.51 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm 13 mm
Base Number Matches 2 3
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

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