CY7C1327G-250AXC vs MCM63P819KTQ133 feature comparison

CY7C1327G-250AXC Cypress Semiconductor

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MCM63P819KTQ133 Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code QFP
Package Description 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 PLASTIC, TQFP-100
Pin Count 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.6 ns 4 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e3 e0
Length 20 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.325 mA
Supply Voltage-Max (Vsup) 3.63 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm 14 mm
Base Number Matches 2 2

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