CY7C1370D-200AXI
vs
71V2556XS100BGI8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
|
BGA,
|
| Pin Count |
100
|
119
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
200 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PQFP-G100
|
R-PBGA-B119
|
| JESD-609 Code |
e3
|
e0
|
| Length |
20 mm
|
22 mm
|
| Memory Density |
18874368 bit
|
4718592 bit
|
| Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
119
|
| Number of Words |
524288 words
|
131072 words
|
| Number of Words Code |
512000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX36
|
128KX36
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
BGA
|
| Package Equivalence Code |
QFP100,.63X.87
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
2.36 mm
|
| Standby Current-Max |
0.07 A
|
|
| Standby Voltage-Min |
3.14 V
|
|
| Supply Current-Max |
0.3 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1370D-200AXI with alternatives
Compare 71V2556XS100BGI8 with alternatives