CY7C1372AV25-100BGC
vs
AS7C33128NTD36A-200BC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ALLIANCE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
QFP
|
Package Description |
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
|
LQFP,
|
Pin Count |
119
|
100
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
5 ns
|
|
Clock Frequency-Max (fCLK) |
100 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B119
|
|
JESD-609 Code |
e0
|
|
Length |
22 mm
|
|
Memory Density |
18874368 bit
|
|
Memory IC Type |
ZBT SRAM
|
|
Memory Width |
18
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
119
|
|
Number of Words |
1048576 words
|
|
Number of Words Code |
1000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
1MX18
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA119,7X17,50
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY
|
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.4 mm
|
|
Standby Current-Max |
0.03 A
|
|
Standby Voltage-Min |
2.38 V
|
|
Supply Current-Max |
0.25 mA
|
|
Supply Voltage-Max (Vsup) |
2.625 V
|
|
Supply Voltage-Min (Vsup) |
2.375 V
|
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
14 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1372AV25-100BGC with alternatives
Compare AS7C33128NTD36A-200BC with alternatives