CY7C1470V25-200BZXC vs CY7C1470V25-200AXI feature comparison

CY7C1470V25-200BZXC Infineon Technologies AG

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CY7C1470V25-200AXI Cypress Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG CYPRESS SEMICONDUCTOR CORP
Package Description FBGA-165 LQFP, QFP100,.63X.87
Reach Compliance Code compliant compliant
Factory Lead Time 2 Days
Access Time-Max 3 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e1 e3
Length 17 mm 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 2MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Equivalence Code BGA165,11X15,40 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Standby Voltage-Min 2.38 V 2.38 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 20 40
Width 15 mm 14 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code QFP
Pin Count 100
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

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