CY7C1470V25-200BZXC
vs
CY7C1470V25-200AXI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
CYPRESS SEMICONDUCTOR CORP
Package Description
FBGA-165
LQFP, QFP100,.63X.87
Reach Compliance Code
compliant
compliant
Factory Lead Time
2 Days
Access Time-Max
3 ns
3 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
200 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e1
e3
Length
17 mm
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Equivalence Code
BGA165,11X15,40
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Standby Voltage-Min
2.38 V
2.38 V
Supply Current-Max
0.45 mA
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
20
40
Width
15 mm
14 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
QFP
Pin Count
100
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
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