CY7C1513JV18-250BZXC vs GS8662D19BD-300I feature comparison

CY7C1513JV18-250BZXC Cypress Semiconductor

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GS8662D19BD-300I GSI Technology

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 LBGA,
Pin Count 165 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINE ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 15 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM DDR SRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX18 4MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 1 2
Factory Lead Time 24 Weeks
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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