CY7C2165KV18-550BZC vs CY7C2165KV18-550BZXC feature comparison

CY7C2165KV18-550BZC Infineon Technologies AG

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CY7C2165KV18-550BZXC Cypress Semiconductor

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Rohs Code No Yes
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG CYPRESS SEMICONDUCTOR CORP
Package Description 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 FBGA-165
Reach Compliance Code compliant compliant
Factory Lead Time 2 Days
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 550 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.34 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.1 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm 13 mm
Base Number Matches 1 1
ECCN Code 3A991
HTS Code 8542.32.00.41