CY7C261-55WI vs AM27C49-45DC feature comparison

CY7C261-55WI Cypress Semiconductor

Buy Now Datasheet

AM27C49-45DC AMD

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, WDIP, DIP24(UNSPEC)
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 55 ns 45 ns
Additional Feature POWER SWITCHED PROM
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.1 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 32.0675 mm
Package Equivalence Code DIP24(UNSPEC)
Seated Height-Max 5.588 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare CY7C261-55WI with alternatives

Compare AM27C49-45DC with alternatives