CY7C263-40WI vs S63364C-P feature comparison

CY7C263-40WI Cypress Semiconductor

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S63364C-P Gould Ami

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GOULD AMI
Part Package Code DIP
Package Description DIP, ,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 40 ns 450 ns
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Memory Density 65536 bit 16384 bit
Memory IC Type UVPROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Supply Current-Max 0.1 mA

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