CY7C68301C-56LTXC
vs
CY7C68301B-56LFXC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
8 X 8 MM, 0.90 MM HEIGHT, LEAD FREE, MO-220, QFN-56
|
8 X 8 MM, LEAD FREE, QFN-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
3
|
| Bus Compatibility |
ATA; ATAPI
|
ATA; ATAPI
|
| Clock Frequency-Max |
24 MHz
|
24 MHz
|
| External Data Bus Width |
|
16
|
| JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
| JESD-609 Code |
e3
|
e3
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC56,.31SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
85 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.45 V
|
| Supply Voltage-Min |
3 V
|
3.15 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
| Width |
8 mm
|
8 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C68301C-56LTXC with alternatives
Compare CY7C68301B-56LFXC with alternatives