CYD18S72V18-200BGI vs CYD18S72AV-100BBI feature comparison

CYD18S72V18-200BGI Rochester Electronics LLC

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CYD18S72AV-100BBI Cypress Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484 BGA,
Pin Count 484 484
Reach Compliance Code unknown compliant
Access Time-Max 3.3 ns 5 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 484 484
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX72 256KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 NOT SPECIFIED
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.16 mm 1.9 mm
Supply Voltage-Max (Vsup) 1.58 V 3.465 V
Supply Voltage-Min (Vsup) 1.42 V 3.135 V
Supply Voltage-Nom (Vsup) 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 23 mm 23 mm
Base Number Matches 2 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

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