CYP15G0401DX-BGI vs CYP15G0401DXB-BGC feature comparison

CYP15G0401DX-BGI Cypress Semiconductor

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CYP15G0401DXB-BGC Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA-256 BGA-256
Pin Count 256 256
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 27 mm
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.745 mm 1.745 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1
Rohs Code No
Data Rate 1500000 Mbps
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Transceivers 4
Package Equivalence Code BGA256,20X20,50
Supply Current-Max 1.1 mA
Terminal Finish TIN LEAD

Compare CYP15G0401DX-BGI with alternatives

Compare CYP15G0401DXB-BGC with alternatives