CYP15G0401DXB-BGXI
vs
CYP15G0401DXA-BGI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
1500000 Mbps
|
1500000 Mbps
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e0
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Number of Transceivers |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HLBGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA256,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.745 mm
|
1.7 mm
|
| Supply Current-Max |
1.1 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
HLBGA, BGA256,20X20,50
|
|
|
|
Compare CYP15G0401DXB-BGXI with alternatives
Compare CYP15G0401DXA-BGI with alternatives