CYUSB3014-BZXI
vs
CYUSB2014-BZXI
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
BGA-121
|
BGA-121
|
Pin Count |
121
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.3
|
3A991.A.3
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bus Compatibility |
I2C; I2S; SPI; UART
|
I2C; I2S; SPI; UART
|
Clock Frequency-Max |
52 MHz
|
52 MHz
|
Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B121
|
S-PBGA-B121
|
JESD-609 Code |
e1
|
e1
|
Length |
10 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
121
|
121
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA121,11X11,32
|
BGA121,11X11,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
200 mA
|
200 mA
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
2
|
2
|
|
|
|
Compare CYUSB3014-BZXI with alternatives
Compare CYUSB2014-BZXI with alternatives