D27256-1 vs TD27C256-2 feature comparison

D27256-1 Intel Corporation

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TD27C256-2 Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Package Description DIP-28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 170 ns 120 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T28
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Terminals 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 12.75 V
Qualification Status Not Qualified
Supply Current-Max 0.1 mA 0.03 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO
Technology MOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 5 4
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.001 A
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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