D2732 vs WS57C43B-55DMB feature comparison

D2732 Rochester Electronics LLC

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WS57C43B-55DMB Waferscale Integration Inc

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC WAFERSCALE INTEGRATION INC
Package Description DIP-24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-XDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 21 V
Standby Current-Max 0.035 A 0.035 A
Supply Current-Max 0.115 mA 0.095 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology HMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 2 1
Access Time-Max 55 ns
JESD-609 Code e0
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare D2732 with alternatives

Compare WS57C43B-55DMB with alternatives