DAC081C085CIMM/NOPB
vs
DAC081C085CIMMX/NOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Reach Compliance Code |
compliant
|
compliant
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Linearity Error-Max (EL) |
3.1%
|
3.1%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Settling Time-Max |
4.5 µs
|
4.5 µs
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Base Number Matches |
2
|
2
|
|
|
|