DEI1071-SES vs DEI1075A-SES-G feature comparison

DEI1071-SES Device Engineering Incorporated

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DEI1075A-SES-G Device Engineering Incorporated

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Part Life Cycle Code Obsolete Active
Part Package Code SOIC SOIC
Package Description Hlsop, Sop8,.25 Hlsop,
Pin Count 8 8
Reach Compliance Code Unknown Compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output Yes Yes
Driver Number of Bits 1 1
Input Characteristics Standard Differential
Interface IC Type Line Driver Line Driver
Interface Standard Arinc 429 Arinc 429
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 Mm 4.9 Mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code HLSOP HLSOP
Package Equivalence Code SOP8,.25
Package Shape Rectangular Rectangular
Package Style Small Outline, Heat Sink/Slug, Low Profile Small Outline, Heat Sink/Slug, Low Profile
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 Mm 1.55 Mm
Supply Voltage-Max 16.5 V 16.5 V
Supply Voltage-Min 9.5 V 9.5 V
Supply Voltage-Nom 15 V 15 V
Surface Mount Yes Yes
Technology Bicmos Bipolar
Temperature Grade Other Other
Terminal Form Gull Wing Gull Wing
Terminal Pitch 1.27 Mm 1.27 Mm
Terminal Position Dual Dual
Width 3.9 Mm 3.89 Mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel Palladium Gold
Time@Peak Reflow Temperature-Max (s) 40