DEI1075A-SES-G vs DEI1070A-SMB-G feature comparison

DEI1075A-SES-G Device Engineering Incorporated

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DEI1070A-SMB-G Device Engineering Incorporated

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Part Package Code SOIC SOIC
Package Description Hlsop, Hlsop,
Pin Count 8 8
Reach Compliance Code Compliant Compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output Yes Yes
Driver Number of Bits 1 1
Input Characteristics Differential Differential
Interface IC Type Line Driver Line Driver
Interface Standard Arinc 429 Arinc 429
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 4.9 Mm 4.9 Mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code HLSOP HLSOP
Package Shape Rectangular Rectangular
Package Style Small Outline, Heat Sink/Slug, Low Profile Small Outline, Heat Sink/Slug, Low Profile
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 Mm 1.55 Mm
Supply Voltage-Max 16.5 V 16.5 V
Supply Voltage-Min 9.5 V 9.5 V
Supply Voltage-Nom 15 V 15 V
Surface Mount Yes Yes
Technology Bipolar Bipolar
Temperature Grade Other Military
Terminal Finish Nickel Palladium Gold Nickel Palladium Gold
Terminal Form Gull Wing Gull Wing
Terminal Pitch 1.27 Mm 1.27 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) 40 40
Width 3.89 Mm 3.89 Mm
Base Number Matches 1 1