DG181BP
vs
DG182AP/883B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP, DIP14,.3
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-XDIP-T14
|
R-CDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Normal Position |
NC
|
NC
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Switching |
MAKE-BEFORE-BREAK
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
4
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance-Max (Ron) |
|
75 Ω
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Switch-off Time-Max |
|
130 ns
|
| Switch-on Time-Max |
|
250 ns
|
| Technology |
|
JFET
|
|
|
|
Compare DG182AP/883B with alternatives