DG181BP vs DG381ACJ feature comparison

DG181BP General Electric Solid State

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DG381ACJ Temic Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE TEMIC SEMICONDUCTORS
Package Description DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0
Normal Position NC
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Output SEPARATE OUTPUT
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Switching MAKE-BEFORE-BREAK
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 3
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Channels 1
Off-state Isolation-Nom 62 dB
On-state Resistance-Max (Ron) 50 Ω
Supply Current-Max (Isup) 1 mA
Supply Voltage-Nom (Vsup) 15 V
Technology CMOS