DG212BDQ
vs
DG9424DQ
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SILICONIX INC
|
SILICONIX INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
TSSOP, TSSOP16,.25
|
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Normal Position |
NO
|
NO
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
On-state Resistance-Max (Ron) |
200 Ω
|
15.1 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Switch-on Time-Max |
300 ns
|
163 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
4
|
|
|
|
Compare DG212BDQ with alternatives
Compare DG9424DQ with alternatives