DG212BDY
vs
HI1-0508/883
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Reach Compliance Code |
unknown
|
unknown
|
Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
8
|
Number of Functions |
4
|
1
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
90 dB
|
68 dB
|
On-state Resistance Match-Nom |
2 Ω
|
9 Ω
|
On-state Resistance-Max (Ron) |
85 Ω
|
300 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
|
Supply Current-Max (Isup) |
0.05 mA
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Switch-on Time-Max |
1000 ns
|
500 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
5
|
Part Package Code |
|
DIP
|
Package Description |
|
DIP,
|
Pin Count |
|
16
|
HTS Code |
|
8542.39.00.01
|
Switch-off Time-Max |
|
500 ns
|
|
|
|
Compare HI1-0508/883 with alternatives