DG307ABK vs HS1-307RH/883S feature comparison

DG307ABK Maxim Integrated Products

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HS1-307RH/883S Harris Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description 0.300 INCH, CERDIP-14 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-GDIP-T14 R-CDIP-T14
JESD-609 Code e0 e0
Length 19.43 mm
Moisture Sensitivity Level 1
Neg Supply Voltage-Max (Vsup) -18 V
Neg Supply Voltage-Min (Vsup) -5 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Channels 1 1
Number of Functions 2 2
Number of Terminals 14 14
Off-state Isolation-Nom 62 dB
On-state Resistance-Max (Ron) 50 Ω 60 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -25 °C -55 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 5 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 150 ns 450 ns
Switch-on Time-Max 250 ns 500 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 7.62 mm
Base Number Matches 2 2
Supply Current-Max (Isup) 1 mA

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Compare HS1-307RH/883S with alternatives