DG418LDJ
vs
DG417C/D
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIE
|
| Package Description |
DIP,
|
DIE-7
|
| Pin Count |
8
|
7
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDIP-T8
|
R-XUUC-N7
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.375 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Max (Vsup) |
-20 V
|
-20 V
|
| Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
-4.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
7
|
| Off-state Isolation-Nom |
90 dB
|
68 dB
|
| On-state Resistance Match-Nom |
0.1 Ω
|
3 Ω
|
| On-state Resistance-Max (Ron) |
35 Ω
|
35 Ω
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max (Vsup) |
20 V
|
20 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
185 ns
|
145 ns
|
| Switch-on Time-Max |
175 ns
|
175 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare DG418LDJ with alternatives
Compare DG417C/D with alternatives