DG508ABK
vs
M38510/19007BEC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
DEFENSE LOGISTICS AGENCY
|
| Package Description |
DIP-16
|
CERAMIC, DIP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T16
|
R-CDIP-T16
|
| JESD-609 Code |
e0
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
68 dB
|
|
| On-state Resistance Match-Nom |
16.2 Ω
|
|
| On-state Resistance-Max (Ron) |
450 Ω
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Signal Current-Max |
0.02 A
|
|
| Supply Current-Max (Isup) |
2.4 mA
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
8
|
2
|
| Screening Level |
|
MIL-M-38510 Class B
|
| Switch-off Time-Max |
|
1500 ns
|
| Switch-on Time-Max |
|
1500 ns
|
|
|
|
Compare M38510/19007BEC with alternatives