DP85C960-25 vs AM8238XC feature comparison

DP85C960-25 Intel Corporation

Buy Now Datasheet

AM8238XC AMD

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIE
Package Description DIP, DIE, DIE OR CHIP
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Bus Compatibility 80960A/KB 9080; 8080A
Clock Frequency-Max 25 MHz 4 MHz
JESD-30 Code R-GDIP-T28 R-XUUC-N28
Length 37.15 mm
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.72 mm
Supply Current-Max 25 mA 190 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CHMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
uPs/uCs/Peripheral ICs Type SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR
Base Number Matches 1 1
Package Equivalence Code DIE OR CHIP

Compare DP85C960-25 with alternatives

Compare AM8238XC with alternatives