DPA02259RVER
vs
FAN2315AMPX
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ONSEMI
|
Package Description |
HVQCCN,
|
QFN-34
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
onsemi
|
Additional Feature |
SUPPLY VOLTAGE= 1.5V TO 18V ALSO REQUIRED
|
OUTPUT VOLTAGE 0.6V TO 5.5V
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
18 V
|
18 V
|
Input Voltage-Min |
1.5 V
|
4.5 V
|
JESD-30 Code |
R-PQCC-N28
|
R-PBCC-N34
|
JESD-609 Code |
e4
|
e3
|
Length |
4.5 mm
|
5.5 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
|
Number of Terminals |
28
|
34
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
8 A
|
20 A
|
Output Voltage-Max |
5.5 V
|
|
Output Voltage-Min |
0.6 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HBCC
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
1.15 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
1000 kHz
|
1000 kHz
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
3.5 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
Manufacturer Package Code |
|
483AM
|
Input Voltage-Nom |
|
12 V
|
|
|
|
Compare DPA02259RVER with alternatives
Compare FAN2315AMPX with alternatives