DS1010S-100
vs
DS1010{DIE}-125
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
DIE
|
| Package Description |
SOP,
|
DIE,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
|
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
|
| Family |
1010
|
CMOS/TTL
|
| Input Frequency-Max (fmax) |
6.25 MHz
|
|
| JESD-30 Code |
R-PDSO-G16
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10.3 mm
|
|
| Logic IC Type |
SILICON DELAY LINE
|
SILICON DELAY LINE
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
10
|
10
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Delay Line |
NO
|
NO
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Total Delay-Nom (td) |
100 ns
|
125 ns
|
| Width |
7.5 mm
|
|
| Base Number Matches |
3
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare DS1010{DIE}-125 with alternatives