DS1123LE-100
vs
DS1023-25
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP-16
|
DIP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
1123
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5 mm
|
|
| Logic IC Type |
ACTIVE DELAY LINE
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP16,.25
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
30 mA
|
60 mA
|
| Programmable Delay Line |
NO
|
YES
|
| Prop. Delay@Nom-Sup |
22 ns
|
80 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare DS1123LE-100 with alternatives