DS1225AB-200IND
vs
DS1225AB-200
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
MODULE
|
|
| Package Description |
0.720 INCH, DIP-28
|
0.720 INCH, EXTENDED, DIP-28
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
200 ns
|
200 ns
|
| Additional Feature |
10 YEAR DATA RETENTION
|
|
| JESD-30 Code |
R-PDMA-P28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
NON-VOLATILE SRAM MODULE
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
3
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP28,.6
|
| Standby Current-Max |
|
0.005 A
|
| Supply Current-Max |
|
0.075 mA
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|