DS1250AB-70IND+ vs DS1250Y-70IND+ feature comparison

DS1250AB-70IND+ Maxim Integrated Products

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DS1250Y-70IND+ Dallas Semiconductor

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC DALLAS SEMICONDUCTOR
Part Package Code MODULE
Package Description 0.740 INCH, ROHS COMPLIANT, DIP-32 DIP-32
Pin Count 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8473.30.11.40 8542.32.00.41
Access Time-Max 70 ns 70 ns
Additional Feature 10 YEAR DATA RETENTION
JESD-30 Code R-XDMA-P32 R-PDIP-P32
JESD-609 Code e3
Memory Density 4194304 bit 4194304 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 512KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0006 A
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 3
Length 43.055 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 10.92 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

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