DS1265Y-70
vs
SYS81000FKLI-025
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOSAIC SEMICONDUCTOR INC
|
| Part Package Code |
MODULE
|
MODULE
|
| Package Description |
0.740 INCH, DIP-36
|
,
|
| Pin Count |
36
|
36
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
70 ns
|
25 ns
|
| Additional Feature |
10 YEAR DATA RETENTION PERIOD
|
|
| JESD-30 Code |
R-XDMA-P36
|
R-XDMA-T36
|
| JESD-609 Code |
e0
|
|
| Length |
53.085 mm
|
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
36
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1MX8
|
1MX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
10.29 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
3A991.B.2.A
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
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