DS1302Z/T&R
vs
DS1302ZN
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, SOIC-8
|
0.150 INCH, SOIC-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
BURST MODE RAM DATA TRANSFER; TIMEKEEPING CURRENT = 0.3UA
|
BURST MODE RAM DATA TRANSFER; TIMEKEEPING CURRENT = 0.3UA
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
SERIAL, 3-WIRE
|
SERIAL, 3-WIRE
|
| Interrupt Capability |
N
|
N
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Timers |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time-Min |
SECONDS
|
SECONDS
|
| Volatile |
YES
|
YES
|
| Width |
3.9 mm
|
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
1
|
2
|
| On Chip Data RAM Width |
|
8
|
| RAM (words) |
|
31
|
|
|
|
Compare DS1302Z/T&R with alternatives