DS1339U-33+
vs
DS1339U-33
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
ROHS COMPLIANT, MICRO, SOP-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
SERIAL(I2C)
|
SERIAL(I2C)
|
| Interrupt Capability |
Y
|
Y
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Timers |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time-Min |
SECONDS
|
SECONDS
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Volatile |
NO
|
NO
|
| Width |
3 mm
|
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
2
|
3
|
|
|
|
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