DS2181AQ
vs
MT8979AP1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
DALLAS SEMICONDUCTOR
|
MICROSEMI CORP
|
| Package Description |
PLASTIC, LCC-44
|
LEAD FREE, PLASTIC, MS-018AC, LCC-44
|
| Reach Compliance Code |
unknown
|
compliant
|
| Carrier Type |
CEPT PCM-30/E-1
|
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| JESD-609 Code |
e0
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC44,.7SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
10 mA
|
16 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
LPCC
|
| Pin Count |
|
44
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
16.585 mm
|
| Seated Height-Max |
|
4.57 mm
|
| Width |
|
16.585 mm
|
|
|
|
Compare MT8979AP1 with alternatives