DS2182N
vs
MT8979AC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ZARLINK SEMICONDUCTOR INC
|
| Package Description |
0.600 INCH, DIP-28
|
CERAMIC, DIP-28
|
| Reach Compliance Code |
compliant
|
unknown
|
| JESD-30 Code |
R-PDIP-T28
|
R-CDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
36.83 mm
|
36.83 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
6.35 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
10.16 mm
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Carrier Type |
|
CEPT PCM-30/E-1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
0.015 mA
|
|
|
|
Compare DS2182N with alternatives