DS3112+
vs
DS26401N+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
|
Package Description |
27 X 27 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-256
|
|
Pin Count |
256
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-PBGA-B256
|
|
JESD-609 Code |
e3
|
|
Length |
27 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA256,20X20,50
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.34 mm
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
27 mm
|
|
Base Number Matches |
10
|
4
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DS3112+ with alternatives
Compare DS26401N+ with alternatives